Known exploited · Qualcomm
CVE-2023-33063: Qualcomm Multiple Chipsets Use-After-Free Vulnerability
What it is
Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.
- Vendor
- Qualcomm
- Product
- Multiple Chipsets
- Added to KEV
- December 5, 2023
- CISA due date
- December 26, 2023
- Ransomware use
- Unknown
- Weakness
- CWE-416: Use After Free
What CISA requires
Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
Forensic triage
No
What to do now
- Find every instance of Multiple Chipsets you run, including the forgotten ones, and check its version against the vendor advisory.
- Apply the vendor's fix or mitigation, before December 26, 2023 if you are bound by CISA's deadline, sooner if it faces the internet.
- Assume it was tried against you already: look for signs of exploitation from the date it was added, not from the day you patched.
References
H2 Security
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Start freeSource: CISA Known Exploited Vulnerabilities Catalog (public domain), catalog version 2026.10.01.